| 摘要 |
PURPOSE:To provide an epoxy resin composition excellent in moldability, humidity resistance, cracking resistance, etc., by reacting at least part of an epoxy resin and/or a phenolic resin with a phenolic silicone oil and mixing the reaction product with a cure accelerator, a filler, etc. CONSTITUTION:An epoxy resin (A) (e.g. bisphenol epoxy resin), a phenolic resin (B) (e.g. phenol novolac resin) as a curing agent, a cure accelerator (C) (e.g. triphenylphosphine), a filler (D) (e.g. silica) and a phenolic silicone oil (E) (e.g. a compound of the formula (wherein R is an alkyl or an aryl; R' is an alkylene or a phenylene) are prepared as essential components materials. At least part of component A and/or B are reacted with component E to modify the former two, and the product is mixed with component C, component D, etc., to produce an epoxy resin composition desirable for semiconductor sealing. |
