| 摘要 |
<p>PURPOSE:To eliminate the contamination of the exposed surface of a copper circuit due to a molten flow-out adhesive by constituting an intermediate layer of a soft polyolefin layer and forming a crystalline polymethylpentene to both inner and outer surfaces thereof. CONSTITUTION:Crystalline polymethylpentene layers 1, 1' formed as inner and outer layers act as release films and a soft polyolefin layer 2 being an intermediate layer acts as a cushion layer and, since these layers are a laminate adhered by adhesive layers 3, 3', the troublesomeness of work is eliminated and, since the soft polyolefin layer has proper cushioning properties, the pushing-in of coverlay to a non-printed part is certainly performed in a press process of a flexible printed circuit board and the molding of the integrated flexible printed circuit board having no gap at all is achieved.</p> |
