| 摘要 |
PURPOSE:To automatize a manufacture by a method wherein input electrodes on an LED array are arranged at a pitch smaller than the arrangement pitch of LEDs, and output electrodes on a driver IC are arranged at the same pitch as the arrangement pitch of the input electrodes on the LED array. CONSTITUTION:On a substrate 1, a plurality of LED arrays 2 are provided. On the LED array 2, LEDs 2a are linearly arranged equidistantly at a pitch P0. On the LED array 2, aluminum electrodes 2b for inputting drive signals to the LEDs 2a are arranged at a pitch P2 smaller than the arrangement pitch of the LEDs 2a. The LEDs 2a are disposed close to the center of the LED array 2 as a whole. Furthermore, output electrodes 3a on a driver IC 3 are arranged at a pitch P2 opposedly to the aluminum electrodes 2b on the LED array 2. In this manner, wire bonds 4 to be connected to the aluminum electrodes 2b and the output electrodes 3a can be provided at a predetermined pitch and in parallel with each other. Thus, all bonding operations can be easily automatized, and productivity can be improved. |
