| 摘要 |
PURPOSE:To decrease the quantity of thermal distortion during use and to produce a target which obviates the exfoliation and camber of a cooling plate by interposing specific solder between a target for sputtering and the cooling plate and heating the same under pressure thereby press-welding the target and the cooling plate. CONSTITUTION:A sheet consisting of Sn, Sn-Ag alloy or Sn-Pb alloy having 0.02-1mm thickness is interposed between the target for sputtering and the cooling plate consisting of a copper metal as a cushion material and the low melting solder consisting of In, In-Sn alloy or Ga, Ga alloy, etc., having a low m.p. is interposed therebetween and is pressurized under >=0.3kg/cm<2> pressure. The assembly is heated to melt the low melting solder. The unreacted solder melt is discharged from the joint surfaces, by which the target and the cooling plate are soldered. The target which has the decreased quantity of thermal distortion event at a high temp., does not camber and obviates the exfoliation and detachment of the cooling plate is thus obtd. |
