| 摘要 |
PURPOSE:To produce a prepreg having excellent adhesivity and capable of giving an IC having high packaging density, by preliminarily impregnating a substrate with a specific addition-type imide resin prepolymer, drying the polymer, impregnating the substrate with a separately prepared addition-type imide resin prepolymer and finally drying the resin. CONSTITUTION:A substrate is preliminarily impregnated with a prepolymer solution having a solid concentration of 1-30% and containing an addition-type imide resin prepolymer synthesized from an unsaturated bisimide and a diamine in a manner to get a (bismide/diamine) molar ratio of 2.0/(1.1-3.0), and the resin is dried (preferably at 140-165 deg.C) to obtain a primary prepreg. The prepreg is further impregnated with a separately prepared addition-type imide resin prepolymer solution and dried to obtain the objective product. The prepolymer for the secondary impregnation is preferably the one containing 30-55% unreacted raw materials, 51-70% component having a molecular weight of 400-15,000 and 5-15% component having a molecular weight of >=15,000. |
