| 摘要 |
PURPOSE:To prevent bending and damage of an outer lead terminal by forming a reinforced layer for improved rigidity by laminating for example Cu foil which is thicker than wiring at the part of the outer lead terminal. CONSTITUTION:After punching an outer lead terminal hole 10 with a die at an IC substrate base 1 located within a tape in 50-150mum in thickness made of polyimide material, a first Cu foil in approximately 35mum in thickness is laminated on the entire both surfaces of a carrier tape 20. Then, a second Cu foil 3 of 70 to 150mum in thickness is laminated on one surface (single surface) of the carrier tape 20 so that the part of the outer lead terminal hole 10 may be covered excluding the range for forming a land 4 and wiring. Thus, by edging the tape surface where 2 Cu foils are laminated by the edging process, the land 4, wiring, and an outer lead terminal 2 are formed by the first Cu foil and a reinforced layer 3 for the outer lead terminal 2 is formed at the outer lead terminal 2 by the second Cu foil 3. |
