| 摘要 |
<p>PURPOSE:To prevent the damage of an electronic component by an external force occurring by constituting a device of plural electronic components with different height packaged on a printed board, a first base material stuck on the back plane side of the board, and a second base material stuck on a dam, and setting the upper plane of the electronic component with the highest height so as to be slided with the lower plane of the second base material. CONSTITUTION:The dam 12 having an aperture hole 12a where the electronic component is housed is fixed on the printed board 11 via a first adhesive layer 13. Also, a various kinds of electronic components 14a-14e with different height on the board 11 are packaged in a state where they are housed in the aperture holes 12a, respectively. A back board 16 is provided on the back plane of the board 11 via a second adhesive layer 15, and a top board 18 is provided on the electronic components 14a, 14b, 14d, and 14e via a third adhesive layer 17. Also, a gap 19 between the back plane of the top board 18 and the upper plane of the electronic component 14c is formed as a small gap to generate the sliding state of the back plane of the top board 18 with the upper plane of the board 11 when the external force is applied on electronic equipment. In such a way, it is possible to evade the damage of the electronic component by the external force.</p> |
