| 摘要 |
PURPOSE:To realize a large-scale system and to enhance production yield and integration density by a method wherein a semiconductor device is formed after a plurality of chips have been piled up and connected in such a way that individual input/output terminals are faced to each other. CONSTITUTION:The following are prepared: a plurality of semiconductor element (synapse, neuron) chips 11, 12 which are provided with input/output terminals on one main face and which are not packaged; a chip 13, for wiring use, where wiring parts used to connect the chips 11, 12 and input/output terminals corresponding to their input/output terminals have been installed on one main face. Then, a solder 24 is placed on the input/output terminals 23 of semiconductor element chips 11, 12, 21 and of chips 13, 21 for wiring use; after that, the semiconductor element chips 11, 12, 21 are arranged on the chips 13, 21 for wiring use in such a way that their input/output terminals 23 are faced with the input/ output terminals 23 corresponding to the chips 13, 21 for wiring use. Then, a heat treatment is executed; the solder 24 is melted; the opposite input/output terminals 23 are connected electrically. Thereby, a large-scale system can be realized and production yield and integration density can be enhanced. |
