| 摘要 |
<p>PURPOSE:To improve bonding resistance, heat resistance, let-go performance due to lead bending, and wettabilities on solder dipping by using a rhenium plating film at a ground layer for a metal plating layer to be provided at a metal part of a package. CONSTITUTION:A ceramic substrate 1 has pads 2 such as a die-bonding part, a wire bonding part, and a lead connection part and tungsten or molybdenum are metallized on the pads 2. Then, with a first nickel film 3, nickel is formed at the pads 2 by electroless plating or electrical plating. Then, a lead for external introduction 11 is mounted on a silver solder material 7. Then, a second nickel film 4 is formed 2-5mum in thickness by electrical plating. A rhenium film 5 is formed on a nickel film 4, thus preventing nickel from being exposed to the surface of a metal film.</p> |
