发明名称 LEAD FRAME
摘要 PURPOSE:To correctly recognize a position of an inner lead by installing the inner lead of a structure whose tip position is protruding or hollowed from the tip of other inner leads. CONSTITUTION:Inner leads 2 whose one or plurality of inner leads protrude or are recessed from a tip position of an inner lead 1 are provided; a protruding or recessed amount is set within a range of 0.05 to 5.0mm. When a position of the tip of the inner lead 1 is recognized during a wire bonding process, the protruding parts 2 are used as recognition parts; then, the parts are not recognized erroneously by a similar lead; when the protruding leads 2 are arranged in a symmetrical direction, they can be recognized doubly by recognizing a shape and by recognizing distances (a), (b). Thereby, the position of the inner leads can be recognized surely during the wire bonding process; it is possible to remarkably reduce a connection error and the like by an erroneous recognition operation.
申请公布号 JPH02174151(A) 申请公布日期 1990.07.05
申请号 JP19880328274 申请日期 1988.12.26
申请人 MATSUSHITA ELECTRON CORP 发明人 URASAKI YOSHIO;ITO HITOSHI
分类号 H01L21/60;H01L23/50 主分类号 H01L21/60
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