Removing meltable material.

摘要

A solder bridge (12) between leads (14,16) of a microelectronic circuit is removed by projecting a laser beam (42) onto the solder bridge with sufficient power to cause the solder forming the bridge to melt and to flow onto a wicking tool (50) placed into contact with the solder bridge. The wicking tool (50) is removed during the heating to remove the solder and debridge the leads. Microelectronic leads having a width of the order of 4 mils and a pitch of the order of 8 mils may be debridged.