发明名称 |
CONFORMAL SEALING AND INTERPLANAR ENCAPSULATION OF ELECTRONIC DEVICE STRUCTURES |
摘要 |
Electronic device packaging structures wherein the active face (6) of an electronic device (4) is mounted facing a substrate (12). Environmental isolation is provided by an overcoat polymeric material (44) at least sealing the space (41) between the device and substrate at the periphery of the device. Enhanced environmental isolation is provided by a polymeric material disposed to substantially fill the space (41) between the device and substrate. The overcoat polymeric material provides enhanced fatigue life to solder mounds disposed between and electrically interconnecting the device and substrate. |
申请公布号 |
EP0340492(A3) |
申请公布日期 |
1990.07.04 |
申请号 |
EP19890106476 |
申请日期 |
1989.04.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
AMEEN, JOSEPH GEORGE;BUCHWALTER, STEPHEN LESLIE;KOVAC, CAROLINE ANN;PALMER, MICHAEL JON;POORE, PAIGE ADAMS |
分类号 |
H01L25/18;H01L21/56;H01L21/60;H01L23/02;H01L23/08;H01L23/29;H01L23/31;H01L25/04 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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