首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
BUMP PLATING METHOD
摘要
申请公布号
JPH02173286(A)
申请公布日期
1990.07.04
申请号
JP19880328422
申请日期
1988.12.26
申请人
SEIKO INSTR INC
发明人
OGAWA KENICHI;MAEMURA YOSHIJI
分类号
C25D5/08;H01L21/321;H01L21/60
主分类号
C25D5/08
代理机构
代理人
主权项
地址
您可能感兴趣的专利
EQUIPMENT FOR USE IN LAYING DOWN GLASS FIBER BLANKET
BORON-CARBON-SILICON ALLOY AND METHOD OF PRODUCING THE SAME
OXIDATION OF ISOBUTYLENE TO METHACRYLALDEHYDE OVER COMPLEX TUNGSTEN OXIDE CATALYSTS
APPARATUS FOR CURING TIRES
WATER-SOLUBLE PAINT COMPOSITION
DUST COLLECTOR
HIGH PRESSURE ETHYLENE POLYMERIZATION
FABRICATION OF CONTACTS FOR SEMICONDUCTIVE DEVICES
INJECTION-LUMINESCENT DIODES
PIPE RECOVERY LOG
ACTUATING LEVER FOR A SWITCH
EMULSIFIABLE WAXES
SAMPLING CIRCUITS
PROCESS FOR THE POLYMERIZATION OF LACTAMS IN ALKALINE MEDIUM
STABILIZATION OF POLYMERIC MATERIALS AGAINST DEGRADATION TO ULTRAVIOLET RADIATION
PREPARATION OF STORABLE MOISTURE-CURABLE POLYURETHANE COATING COMPOSITIONS
KETOAMINES AND COMPOSITIONS THEREOF
PRODUCTION OF TRIMETHYLAMINE-SULFUR TRIOXIDE COMPLEX
GUANIDINO DERIVATIVES OF POLYALKYLENE POLYAMINES
PEPTIDE DERIVATIVES