SEMICONDUCTOR PACKAGING MODULE AND HEAT-CONDUCTING BLOCK STRUCTURE USED THEREFOR.

摘要

A semiconductor packaging module for efficiently removing the heat generated from a plurality of semiconductor elements. The semiconductor packaging module is so designed that cooling water can enter inside a protrusion with a triangular cross section of the heat-conducting block and flow near the semiconductor elements that generate heat. Thus, efficient cooling is possible on the heat-conducting block structure and the semiconductor packaging module.