Semiconductor module.

摘要

Multichip module with provisions for improved cooling and interconnection so as to allow for maximum chip packaging density. Air cooling is brought about by a zig-zag arrangement of groups (6) of thin wire cooling fins (5) mounted on a heat sink layer (3) also providing the necessary mechanical rigidity of the module. Said interconnection means comprises a layer (22) containing diamond grains (23) having high electrical insulating and high thermal conductive properties.