发明名称 Apparatus for preventing the oxidation of lead frames during bonding
摘要 An apparatus for preventing the oxidation of a lead frame in a bonding system. The apparatus has a first introducing device for introducing a first atmospheric gas toward a bonding portion of the lead frame and a second introducing device for introducing a second atmospheric gas to shield the bonding portion from contact with ambient air simultaneously with the introduction of the first atmospheric gas.
申请公布号 US4938834(A) 申请公布日期 1990.07.03
申请号 US19890305024 申请日期 1989.02.02
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 YAMAMOTO, MASAYUKI;HAYASHI, KAZUYUKI
分类号 H01L21/60;H01L21/00 主分类号 H01L21/60
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