发明名称 |
Apparatus for preventing the oxidation of lead frames during bonding |
摘要 |
An apparatus for preventing the oxidation of a lead frame in a bonding system. The apparatus has a first introducing device for introducing a first atmospheric gas toward a bonding portion of the lead frame and a second introducing device for introducing a second atmospheric gas to shield the bonding portion from contact with ambient air simultaneously with the introduction of the first atmospheric gas.
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申请公布号 |
US4938834(A) |
申请公布日期 |
1990.07.03 |
申请号 |
US19890305024 |
申请日期 |
1989.02.02 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
YAMAMOTO, MASAYUKI;HAYASHI, KAZUYUKI |
分类号 |
H01L21/60;H01L21/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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