| 摘要 |
PURPOSE:To easily correspond with the heating value of an integrated circuit, and cool stably the circuit without applying force to the upper surface of an integrated circuit case by providing the integrated circuit case with many conduction pins, and inserting them into insertion holes arranged on a cold plate. CONSTITUTION:An integrated circuit case 1 mounting an integrated circuit is fixed on a printed wiring board 2 by using leads 4, and many thermal conduction pins 5 are arranged on the bottom surface of the case. Through holes 6 are formed at the parts of the printed wiring board which correspond with the thermal conduction pins 5; insertion holes 7 corresponding with the thermal conduction pins 5 are formed in a cold plate 3; the thermal conduction pins 5 are inserted into the through holes 6, and the tip parts of the thermal conduction pins 5 are inserted into the insertion holes 7. Heat generated in the integrated circuit travels from the integrated circuit case 1 to the thermal conduction pins 5. The heat is delivered to the cold plate 3 and cooled. The number of the conduction pins 5 are adjusted according to the heating value. Thereby, the correspondence with the heating value of the integrated circuit is easily enabled, and the stabilized cooling is made possible without applying force to the upper surface of the integrated circuit case. |
