发明名称 APPARATUS FOR BONDING AND CURING
摘要 PURPOSE:To reduce blow-out of gas containing organic component from a bonding window to prevent increase in H2 concentration by providing a gas exhausting means for exhausting from a sample transfer passage gas containing organic component generated from a sample by heating a heat block. CONSTITUTION:Covers 50, 51 are fixed to a top surface of a housing 10 so that a heat block 11 is covered on the left (loader) side and the right (unloader) side of a shielding plate 34. On a lower surface of the cover 50, grooves 50e, 50f are formed perpendicular to a sample transfer passage 53 at an inlet and an outlet of the sample transfer passage 53 formed by the housing 10 and the cover 50. In addition, a groove 50g is also formed at the side of the groove 50e adjacent to the groove 50f, while the groove 50g is provided with a pipe 56 for exhausting gas. At the time of bonding, therefore, most of gas containing organic component generated from the sample is exhausted by the gas exhausting means. This reduces organic component blown out from a bonding window, thereby preventing increase in H2 concentration.
申请公布号 JPH02172244(A) 申请公布日期 1990.07.03
申请号 JP19880327322 申请日期 1988.12.24
申请人 SHINKAWA LTD;KYOCERA CORP 发明人 HASEGAWA TAKESHI;TORIHATA MINORU;HISATAKA MASAFUMI;ODA TSUTOMU
分类号 H01L21/60;H01L21/52 主分类号 H01L21/60
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