| 摘要 |
<p>PURPOSE:To freely form conductor circuits and obtain excellent heat dissipating property and humidity resistance by providing a recessed part for mounting electronic parts, wherein a plated layer of an inner viahole is exposed on one surface of the inner viahole. CONSTITUTION:An electronic parts 31 mounted in a recessed part 30 comes into contact with a metal-plated layer 161 via adhesive agent excellent in thermal conductivity. As a result, heat of the electronic parts 31 is conducted to the plated layer 161 of the inner viahole 16; then it is conducted to a shield layer of a multilayer wiring board in a wiring board or to a plated layer 21 of a through hole 2, and radiated outside the multilayer printed wiring board. There exist lamination boards 13, 15 of one or more layers in the lower part of the recessed part 30, so that moisture can be prevented from permeating into the electronic parts 31. Thereby, conductor circuits can be freely formed, and excellent heat dissipating property and humidity resistance can be obtained.</p> |
