| 摘要 |
<p>A method for selectively applying solder to a catalyst carrier body includes alternately winding smooth and wavy layers of sheet metal into a catalyst carrier body having outer surfaces, dividing at least one of the outer surfaces into regions to be soldered covering a portion of the at least one outer surface as seen in circumferential and radial directions, and applying solder to the regions and a catalyst carrier assembly for carrying out the method.</p> |
