DIE-BONDING APPARATUS FOR SEMICONDUCTOR CHIP,申请号JP19880327184-传众专利搜索

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发明名称	DIE-BONDING APPARATUS FOR SEMICONDUCTOR CHIP
摘要
申请公布号	JPH02172238(A)	申请公布日期	1990.07.03
申请号	JP19880327184	申请日期	1988.12.24
申请人	SUMITOMO ELECTRIC IND LTD	发明人	NISHIGUCHI KATSUNORI;GOTO NOBORU
分类号	H01L21/52	主分类号	H01L21/52
代理机构		代理人
主权项
地址

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