| 摘要 |
An epoxy resin compsn. for encapsulating semiconductor comprises: 10- 30 wt. pts. of cresolnovolac epoxy resin or phenolnovolac epoxy resin having 180-240 epoxy equivs., 60-110≦̸C softening point; 5-20 wt. pts. of phenolnovolac resin or cresolnovolac resin havig 70-110≦̸C softening point; 60-80 wt. pts. of inorg. filler; and 0.1-5 wt. pts. of hume silica having 0.010.5 of particle size, 100-300 m2 of spec. surface area. Pref. the epoxy resin comtains above 3 epoxy gp. per one molecula of that; the inorg. filler is silicon oxide, calcium carbonate, melting silica, alumina or mica.
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