| 摘要 |
<p>PURPOSE:To bring a heat dissipating body into direct contact with the conductor of a board or a base to make a heat dissipating structure of this design small in heat transfer resistance and to improve it in heat dissipating effect by a method wherein a resist attached to the upside of the board or the base under an IC where a heat dissipating body formed of a bonding agent or a sheet comes into contact is removed. CONSTITUTION:A resist 4 attached to a face under an IC 1 where a heat dissipating body 6 comes in contact is removed. And, when the IC 1 is put in operation to release heat, the heat is conducted to a conductor pattern 3 of large thermal conductivity through the intermediary of the heat dissipating body 6 and dissipated from the conductor pattern to a base 2 of a board. At this point, if the conductor pattern 3 is made to extend from the part just under the IC 1 to the periphery of the IC 1 as being put through under leads, a large heat dissipating effect can be obtained. By this setup, a heat dissipating structure of this design can be improved in heat dissipating effect at a low cost.</p> |
