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发明名称
DIE BONDING OF INTEGRATED CIRCUIT DEVICE
摘要
申请公布号
JPH02170440(A)
申请公布日期
1990.07.02
申请号
JP19880323915
申请日期
1988.12.22
申请人
NEC CORP
发明人
SATO MAMORU
分类号
H01L21/52
主分类号
H01L21/52
代理机构
代理人
主权项
地址
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