| 摘要 |
<p>PURPOSE:To fix a ground connection piece more stably by a method wherein a diameter or a distance between opposite sides of a paste fixation part of a composite metal piece for ground connection use is made smaller as compared with a diameter or a distance between opposite sides of a wire bonding part and the tip part of the paste fixation part is chamfered. CONSTITUTION:A semiconductor element 12 is fixed in advance in a low part of a central recessed part in a ceramic substrate 10; the lower part of the recessed part is coated with a fold paste in order to extract a ground from an attached face of the substrate of the element 12; the paste is baked; a conduc tor thin film 14 is formed. The element 12 and a composite metal piece 16 for ground connection use are fixed by a brazing operation; aluminum alloy wires 20, 22 are connected between the element 12 and a lead frame 18 and the metal piece 16 and the lead frame. A diameter or a distance between oppo site sides of a paste fixation part 16b is made smaller than a diameter or a distance between opposite sides of a wire bonding part 16a; a chamfered part 16c is formed at the tip of the paste fixation part 16b; and the metal piece is fixed stably.</p> |
