| 摘要 |
<p>PURPOSE:To restrain corrosion by an invasion of moisture from progressing by a method wherein a plurality of bonding pads are connected by routes which are independent up to a connection point of an input protective circuit and the routes are made zigzag. CONSTITUTION:Two bonding pads 1-1, 1-2 are provided so that an identical semiconductor pellet can be assembled in different cases; they are connected to a connector 4 of one input protective circuit 3 by using separate routes; lead wiring layers 5-1, 5-2 arranged in a zigzag manner at their halfway parts are installed. One out of the two bonding pads is used at an assembly operation; an Al film is exposed at the inside of a through hole 2-1 Or 2-2 of the other bonding pad which is not bonded; moisture which has crept reacts with an impurity such as Cl, P or the like; Al is dissolved. However, the moisture which has crept while it dissolves the Al delays a progress operation of a dissolution of the Al because a lead wiring part is slender; it is possible to elongate a period of time until a defect is caused.</p> |
