EPOXY RESIN SEALING COMPOSITION AND PHOTOSEMICONDUCTOR PREPARED BY USING SAME

摘要

PURPOSE:To provide an epoxy resin sealing composition which can be sufficiently reduced in stress without detriment to its heat resistance by mixing an epoxy resin with an acid anhydride curing agent, a specified cure accelerator and a sulfur-containing phosphorus compound in a specified mixing ratio. CONSTITUTION:100 pts.wt. epoxy resin (e.g. bisphenol epoxy resin) is mixed with 70-140 pts.wt. acid anhydride curing agent (e.g. phthalic anhydride). 0.5-4 pts.wt. cure accelerator comprising and onium salt (e.g. tetrabutylphosphonium chloride) or a diazabicycloalkene salt (e.g. 1,8-diazabicyclo[4.5.0]undecene sulfonate) and 0.1-5 pts.wt. sulfur-containing phosphorus compound (e.g. trimethyl thiophosphite) to produce an epoxy resin sealing composition. This resin composition can be desirably used for sealing a photosemiconductor or the like.