发明名称 SEMICONDUCTOR CUTTER
摘要 PURPOSE:To measure partial displacement of an inner circumferential blade and to accurately determine the shape of a cutting face of a semiconductor single crystal rod in cutting by providing a displacement sensor for measuring displacement of the inner circumferential blade to the position opposite to the inner circumferential blade while pinching a work in cutting. CONSTITUTION:A displacement sensor 14 is oppositely arranged to the part wherein the inner circumferential part of an inner circumferential blade 10 is directly related to cutting of a semiconductor single crystal rod 13. This sensor is fixed to a fixing part for freely rotatably supporting a rotor with the inner circumferential blade 10 fitted thereto. While the crystal rod 13 is cut, displacement of the blade 10 is detected by the sensor 14 beyond a cutting part 13a of the crystal rod 13. The displacement data of the blade 10 detected by the sensor 14 are made thoroughly integral to the shape of a cutting face of the crystal rod 13 in cutting. The cutting part 13a positioned between the blade 10 and the displacement sensor 14 is formed of a semiconductor and does not affect this displacement sensor 14. Therefore both displacement of the blade 10 and the shape of a cutting face of the crystal rod 13 are accurately determined.
申请公布号 JPH02167703(A) 申请公布日期 1990.06.28
申请号 JP19880322747 申请日期 1988.12.21
申请人 MITSUBISHI METAL CORP 发明人 SHIRATORI MASATAKA;AKIYAMA KAZUNARI;TAKAHASHI HIROYUKI
分类号 B28D5/02;B23D59/00;B24B27/06;B28D5/00 主分类号 B28D5/02
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