| 摘要 |
For producing printed circuits provided with contact areas, copper films are pressed against a template provided with raised areas in a predetermined pattern, and the interior of the impressed imprints produced in the copper films is filled with a setting material. After the pre-pressing with prepregs, printed circuits are produced from these pre-laminates. The copper films must have here a breaking tension > 10% and a thickness of 10 to 100 mu m. |
