| 摘要 |
<p>PURPOSE:To eliminate the coating process of a terminal end face by epoxy resin, etc., by confining at least one of plural lead terminals in resin mold. CONSTITUTION:Wire bonding wiring is performed by joining an IC 1 with the tab 11 of a lead frame, and the lead terminal 13 with which the gate terminal 4 of a piezoelectric oscillator 2 is joined is cut at the inner side than the outer peripheral plane 8 of the resin mold after the piezoelectric oscillator 2 is joined with the lead terminal 13 and a pinch lead 14. After that, the pinch lead 14 is cut along the outer peripheral plane 8 of the resin mold, and a side rail 9 is removed. Therefore, at least one of plural lead terminals to be joined with an electronic component can be confined in the resin mold. In such a way, it is possible to dispense with a process to coat by applying the epoxy resin on the cutting part of the outer peripheral plane of the resin mold of the lead terminal with which the electronic component is joined.</p> |
