| 发明名称 |
Bubble free liquid solder mask-coated printed circuit boards by fluid pressurizing. |
| 摘要 |
<p>A method is disclosed of obtaining a bubble free photosensitive liquid layer and an interface with a substrate by applying uniform fluid pressure after coating the liquid on the substrate.</p> |
| 申请公布号 |
EP0374876(A2) |
申请公布日期 |
1990.06.27 |
| 申请号 |
EP19890123541 |
申请日期 |
1989.12.20 |
| 申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
STOUT, GARY KARL |
| 分类号 |
B32B15/08;G03F7/16;H05K3/00;H05K3/28 |
主分类号 |
B32B15/08 |
| 代理机构 |
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代理人 |
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| 地址 |
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