| 摘要 |
PURPOSE:To design a package having small voltage deviation and high mounting density by supplying power to a logic package from the center of the logic package by using a rigid power supply block. CONSTITUTION:Since a logic package 4 is mounted in a containing unit 5, it is engaged with the groove of a card guide 10, and moved to the deep part in the groove. Thus, a bus bar 11 is engaged with the leaf spring 13 of a power supply block 12 at the center of the logic package 4, and a current flowing thereto is fed to the power supply block 12 through the leaf spring 13. The block 12 is connected to the electric wiring pattern in the logic package 4 to supply the current into the logic package. The power supply block 12 is provided between the upper and lower parts of the center of the logic package to prevent the power supply and the warpage of the logic package 4, the wiring pattern length from the power supply can be shortened, and voltage drop value is reduced. Accordingly, a voltage deviation in the logic package is also decreased. |
