Method of manufacturing two-layer printed circuit sheet.

摘要

An insulating sheet (11) having through holes (12) formed therein at positions where circuit patterns formed on its both surfaces are electrically connected is prepared. A sheet (13) for forming a hole bottom is attached to one surface of the insulating sheet (11). Subsequently, a first-layer circuit pattern (15) is printed on the other surface of the insulating sheet (11) to which the hole-bottom sheet (13) is not attached, and a conductive paste (16) is filled into the holes (12). Thereafter, the hole-bottom sheet (13) is removed. Then, a second-layer circuit pattern (20) is printed on the surface of the insulating sheet (11), from which the hole-bottom sheet (13) is removed. With this process, a two-layer printed circuit sheet is manufactured.