| 摘要 |
<p>Apparatus is described for excising and forming tape mounted electronic devices in an automated fashion so that as the tape bearing the components is fed past a punch and die set, each frame bearing an electronic component is precisely aligned and the electronic component has its leads simultaneously excised from the tape and formed in a predetermined configuration, in a self aligning zero clearance punch and die set, the device so excised being then transferred to a presentation area for pickup for subsequent assembly operations.</p> |
