发明名称 METHOD AND DEVICE FOR LASER BEAM MACHINING
摘要 <p>PURPOSE:To execute cutting without allowing a spatter generated at the time of laser beam machining to adhere to the inside surface of a duct by allowing a curtain-like liquid to flow from the upper part to the whole periphery of the inside surface of a dust collecting duct provided on the lower part of a work table being right under a working head. CONSTITUTION:Cutting is executed by irradiating a work W placed on a work table 3 by a laser beam LB from a working head 11. A spatter S generated at the time of laser beam machining tends to adhere to the inside surface of a dust collecting duct 23 of the lower part of the work table. On the outside peripheral part of the upper part of the dust collecting duct, plural holes 23H are provided, a liquid is allowed to flow from a supply use passage 25, and the liquid flows in a shape of a curtain to the whole periphery of the inside surface of the dust collecting duct, therefore, the spatter does not adhere to the inside surface of the duct and cutting is executed. The spatter drops down to a liquid receiving device 27 together with the liquid, and also, adheres to a filter 33 and eliminated. Scraps generated by cutting are contained in a scrap box 37, and dust, etc., adhere to a filter 41.</p>
申请公布号 JPH02165885(A) 申请公布日期 1990.06.26
申请号 JP19880319592 申请日期 1988.12.20
申请人 AMADA CO LTD 发明人 NAKANO OSAMU
分类号 B23K26/00;B23K26/16;B23K26/38;B23Q11/00 主分类号 B23K26/00
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