| 摘要 |
<p>PURPOSE:To avoid the variation of the characteristics of an electronic component caused by the penetration of moisture and the like through gaps between a cover coating and electrodes by a method wherein parts of the underlying electrode layers of the electrodes are covered with the cover coating and outer electrode layers made of solder are formed on the parts of the underlying electrode layers not covered with the cover coating. CONSTITUTION:A resistant film 2 is formed on an alumina ceramic substrate 1 to form a resistor main part. Ni layers having required thicknesses are formed on both ends of the resistor main part by an electrolytic plating method as the underlying electrode layers 5 of electrodes. Then a cover coating 6 made of epoxy resin which has insulating and moisture-resistant properties and having suitable flexibility when it is heated is formed so as to cover the parts of the Ni layers. On the parts of Ni foundation electrode layers 5 not covered with the cover coating 6, Cu layers are formed by an electrolytic plating method as intermediate electrode layers 7; further, solder layers are formed as outer electrode layers 8 to compose electrodes 9. With this construction, even if the solder outer electrode layers 8 are melted by the heat of soldering, gaps are not formed between the electrodes and the covercoating. With this constitution, penetration of moisture and the like can be avoided and the deterioration of the characteristics of the electronic component can be avoided.</p> |
