发明名称 MANUFACTURE OF CIRCUIT BOARD
摘要 PURPOSE:To reduce manufacture time and to improve dimensional accuracy and yield by forming a pattern by printing paste on an insulating ceramic board, by acquiring a conductive circuit pattern by burning it through a heat source for flame-spraying and by forming an insulating layer by flame-spraying an insulating material. CONSTITUTION:Paste 2 is screen-printed on a sintered alumina ceramic board 1 to form a pattern. Then, the paste 2 is burned inside a chamber 6 which is regulated to argon atmosphere through plasma get 3 to acquire a conductive circuit pattern. Mixed powder 4 is transferred into the plasma jet 3 to acquire a flame spray coating 5. Since no organic binder is included in the board 1, there is no possibility that the board 1 develops warp, waviness or dimensional variation. Manufacture time can be thereby reduced, thus improving dimensional accuracy and yield.
申请公布号 JPH02164093(A) 申请公布日期 1990.06.25
申请号 JP19880319997 申请日期 1988.12.19
申请人 MITSUBISHI ELECTRIC CORP 发明人 MIFUKU HIDEFUMI;TAKADA MITSUYUKI;MORIHIRO YOSHIYUKI;TAKASAGO HAYATO
分类号 H05K3/12;H05K3/28 主分类号 H05K3/12
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