| 摘要 |
PURPOSE:To mount an electronic component on a printed circuit board highly accurately and quickly by a method wherein, after a dislocation of the electronic component has been corrected, its dislocation amount is inspected by an optical image processing operation. CONSTITUTION:When a suction nozzle N is shifted to a second station, a disloca tion in a theta direction is corrected by a mechanical means. After a position in the theta direction has been corrected, the nozzle is shifted to a third station; when an electronic component E is irradiated with light from a light source 4, a projected image of the electronic component is picked up with a TV camera 5. An image signal of this projected image is input to an NC apparatus 7 via an image processing apparatus 6; a position of the electronic component by the image signal is compared with a preset reference value; thereby, a disloca tion DELTAtheta1 in the theta direction, DELTAX1 and DELTAY1 including an X direction and a Y direction are computed. In this image processing operation, a defective compo nent such as a breakage or the like can be inspected; a posterior treatment is selected by whether a dislocation amount in the theta direction including the defective component is within a permissible value or not. |
