| 摘要 |
PURPOSE:To execute diversified small-quantity production with good efficiency by a method wherein, after a plurality of different conductive patterns have been formed in partitions divided by index holes in a ribbon-shaped insulating substrate, the substrate is separated into strip-shaped discrete integrated circuit substrates and an exclusive assembly process is executed in the individual strip-shaped discrete integrated circuit substrates having an identical conductive pattern. CONSTITUTION:Index holes 12 are made in a ribbon-shaped insulating substrate 11 in its lengthwise direction at prescribed intervals, after that, a plurality of different conductive patterns 15 are formed in one partition 14, in a width direction of the insulating substrate 11, divided by the index holes 12. Then, the insulating substrate 11 is separated in its lengthwise direction; a stripshaped discrete integrated circuit substrate 17 containing a plurality of identical conductive patterns 15 is formed. Then, a semiconductor element 19 is fixed and bonded in a desired position on the conductive patterns 15 in an exclusive assembly line at each strip-shaped discrete integrated circuit substrate 17 having identical conductive patterns 15; the element is connected to the individual conductive patterns 15 by using thin bonding wires; after that, a discrete integrated circuit substrate 13 is separated from the strip-shaped discrete integrated circuit substrate 17. |
