发明名称 HI RAPIED WIRE
摘要 The method for manufacturing the lead wire having a diameter below 2 mm and having no need for presoldering process comprises steps; (a) makimg a gel mixed with a resin of 60-65 wt.%, a plasticizer of 30-35 wt.%, and an organic solvent; (b) mixing the vinyl chloride adhesive of 1-2 wt.% with the gel; (c) coating the mixed gel on the twisted lead wire by dipping; (d) drying the wire for 10 hrs.; and (e) coating the wire with PVC.
申请公布号 KR900004331(B1) 申请公布日期 1990.06.22
申请号 KR19870010744 申请日期 1987.09.28
申请人 PARK YE-HUI 发明人 PARK YE-HUI
分类号 H01B13/00;(IPC1-7):H01B13/00 主分类号 H01B13/00
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