发明名称 EDGE GRINDING EQUIPMENT FOR SEMICONDUCTOR SUBSTRATE AND GRINDING METHOD
摘要 PURPOSE:To surely eliminate the edge crown of a substrate by a method wherein a rotary shaft moves up and down and grinds the lower edge of a substrate while rotating, the shaft so rotates that the vertical side surface comes into contact with the side surface of the substrate, and the shaft moves toward the fixed jig direction. CONSTITUTION:A rotary shaft 11 so moves downward that the tapered side surface of a grindstone is positioned at the lower part of a substrate; then the shaft moves horizontally toward the direction of a substrate fixing jig, and the tapered side surface 13 of the grindstone reaches the lower end-portion of the substrate; the shaft ascends and stops at the position where the tapered side surface comes into contact with the lower end-portion of the substrate. In this case, the rotary shaft 11 ascends while grinding the substrate. When the eliminating of edge crown is ended, the rotary shaft is separated from the substrate fixing jig; the vertical side surface of the grindstone of the rotary shaft is moved at the same height as the side surface of the substrate; and then the rotary shaft moves toward the direction of the substrate fixing jig, and stops at the position where the vertical side surface of the grindstone comes into contact with the side surface of the substrate. In this state, the rotary shaft rotates, and the side surface of the substrate is grinded and formed by the vertical side face of the grindstone.
申请公布号 JPH02161723(A) 申请公布日期 1990.06.21
申请号 JP19890273570 申请日期 1989.10.20
申请人 FUJITSU LTD 发明人 KIKUCHI YOSHIBUMI;MIYAJIMA MOTOMORI
分类号 H01L21/304 主分类号 H01L21/304
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