Sensor for pressure greater than 50 mega Pascals - has silicon chip with aperture connected to boron silicate body

摘要

The high press. sensor consists of a monocrystalline silicon chip (1) with integrated piezoresistive resistors and a counter body (4) connected to the chip. The chip has a through aperture in its central region to cause a hydrostatic press. loading. The counter body consists of a material with a thermal coefficient of expansion approximately the same as that of silicon and has a different elastomechanical constant. The counter body is made of boron silicate glass and is connected to the silicon chip via an anodic base. USE/ADVANTAGE - In process and system automation. Planar technology sensor can be used with pressure in excess of 50 MPa.