| 摘要 |
PURPOSE:To shorten the wiring distance between a semiconductor stack and a snubber circuit and to decrease wiring inductance by improving connection between the semiconductor stack received in a closed vessel and the outer electric circuit. CONSTITUTION:A GTO stack 1 to be cooled in a boiling cooling medium is immersed in an appropriate quantity of a boiling cooling medium 1 received within a cooling medium chamber 4a of a closed vessel 4, and the stack 1 is connected to an electric circuit such as a snubber circuit or the like arranged outside the vessel 4 through connecting conductors 2a passing through an air- tight terminal 2 provided on a side face of the cooling medium chamber 4a. By this electric connection, the boiling cooling medium 3 is subjected to gas Iiquid phase change occurred between the cooling medium chamber 4a and a boiling chamber formed thereon, and the stack 1 can be cooled by utilizing variation of environment accompanied by the phase change. Snubber diodes 7 of a subber circuit 10 of the stack 1 are attached to the parts of the conductors 2a projected outside the vessel or the parts thereof immersed in the cooling medium within the vessel, the conductors 2a passing through the terminal 2 provided on the container 4. |
