| 摘要 |
<p>1. Thicknessing and surface planing machine with a chip guide plate (10) which forms a flat covering for the plane shaft, is mounted in a guide component (21) - which is disposed laterally with respect to the plane shaft, is open at the top and is approximately C-shaped - such that it is longitudinally displaceable on the machine parallel to the plane shaft (4), and the two edge areas of which are formed as guide components which each engage in a guide (18, 19) of the guide component (21), characterised in that the chip guide plate (10) consists of a flat or at least partially flat curved cover sheet (15) and a rail-like base part (16), which is curved in cross-section, which are connected to one another by means of side plates (23) associated with their ends, each edge area of the cover plate and the base part forming a guide component.</p> |
