发明名称 FABRICATION METHOD FOR SEMICONDUCTOR DEVICE AND FILM FORMATION APPARATUS FOR SAID METHOD.
摘要 <p>A semiconductor device producing method wherein a patterned transparent electrode, a patterned amorphous silicon semiconductor layer and a patterned backside electrode are formed on a substrate sequentially in this order, and the patterning of at least one of the amorphous silicon semiconductor layer and the backside electrode is carried out in a step of forming at least one of the amorphous silicon semiconductor layer and the backside electrode with a wire mask being brought into substantially close contact with a surface subjected to film forming and a step of removing a thin film formed at a region between the wire mask and the surface subjected to film forming in the forming step; and a film forming apparatus used in the producing method comprising a holder which holds a substrate having a surface subjected to film forming, a mechanism for fixing and positioning the substrate on the holder and a plurality of wires which are disposed on the film forming surface side of the substrate and are to be brought into substantially close contact with the film forming surface. The method and the apparatus enable the film forming operation and the patterning operation to be carried out simultaneously without lowering the characteristics of a solar cell.</p>
申请公布号 EP0373221(A1) 申请公布日期 1990.06.20
申请号 EP19880909820 申请日期 1988.11.14
申请人 KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 KOBAYASHI, KENJI;TSUGE, KAZUNORI;TAWADA, YOSHIHISA
分类号 H01L31/042;H01L31/0224;H01L31/04;H01L31/20 主分类号 H01L31/042
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