发明名称 MANUFACTURE OF ALN MULTILAYER SUBSTRATE
摘要 PURPOSE:To eliminate distortion and to prevent development of insulating layer due to removal and carbonization of a surface metallized layer by sealing a conductor inside an aluminum nitride(AlN) green sheet and by burning it. CONSTITUTION:A conductor is sealed inside an aluminum nitride(AlN) green sheet and burnt. As for a sealing method, a green sheet which is provided with a conductor pattern or a conductor via, and a pure green sheet which covers an exposed area of the conductor are laminated. Since a conductor (W via 3, or W pattern 5) is shielded from furnace atmosphere, a surface state of a substrate after sintered is good and a conductor does not carbonized. Furthermore, since the conductor is sintered wrapped in an AlN green sheet, a difference of shrinkage rate is reduced, thereby resulting in reduction of warp of a substrate.
申请公布号 JPH02159096(A) 申请公布日期 1990.06.19
申请号 JP19880314145 申请日期 1988.12.13
申请人 FUJITSU LTD 发明人 OMOTE KOJI;YOKOYAMA HIROZO
分类号 H05K3/46 主分类号 H05K3/46
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