| 摘要 |
This invention relates to a method of forming a plating layer on ceramic chip surfaces by electroless plating, and to electronic parts manufactured by this method. Such electronic parts include a metal film fixed resistor, a capacitor, a resistor for sensing purposes and a patterned substrate, for example. Ceramic chips are immersed in a plating solution containing chromium chloride, nickel sulfide, sodium hypophosphite, a chelating agent and thiourea. Then each ceramic chip is coated with a plating layer by electroless nickel plating while adjusting pH value of the plating solution with a pH regulating liquid. The resulting electronic parts have an initial resistance of 0.02 to 100 ohm or more and a temperature coefficient of resistance of a two-digit figure or less in ppm.
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