Localized cooling apparatus for cooling integrated circuit devices

摘要

A localized cooling apparatus is provided for individually cooling integrated circuit chips mounted on a circuit board for insertion into a computer backplane. The cooling apparatus consists of a circuit board occupying a first slot and having an integrated circuit chip mounted thereon, the performance of which is known to improve by cooling, a heat removal assembly consisting of a heat sink attached to a card edge portion and occupying an adjacent second slot, and a thermoelectric cooler intimately bonded to both the chip and heat removal assembly. A controller provides power via the connector of the second slot to the thermoelectric cooler and stabilizes the temperature of the chip to a predetermined value.