| 摘要 |
PURPOSE:To make it possible to execute easily and accurately a probing using a probe card without being impeded by bonding wires by a method wherein patterns for probing use, which are formed on the periphery of a semiconductor IC chip and are connected to bonding pads on the chip through the bonding wires, are formed. CONSTITUTION:Patterns 5a for probing use are respectively formed on the sides opposite to bonding pads 4 of a chip 3 in such a way that probing needles 8 can be made to come into contact with the patterns 5a stably without being impeded by bonding wires 6. In short, the probing needles 8 and the wires 6 are made to have such a positional relation that the probing needles 8 do not superpose on the wires 6 or the probing needles 8 do not come into contact to the wires 6 as seen two-dimensionally in a state that the probing needles are made to come into contact to the patterns 5a. Thereby, a probing can be executed easily and accurately. |
