| 摘要 |
<p>PURPOSE:To sufficiently reduce in thickness a semiconductor element without decreasing strength by integrally attaching a reinforcing layer on the rear face of the semiconductor element formed with an integrated circuit on its one main surface. CONSTITUTION:A semiconductor device 1 is composed of a semiconductor element 3 and a reinforcing layer 4 attached integrally with the rear face of the element 3. If the strength of the reinforcing layer 4 is ten times as large as that of the semiconductor element 3, the thickness of the semiconductor device 1 attached with the reinforcing layer 4 on its rear face can be reduced to 1/10 as compared with the case that the semiconductor device 1 is composed of only the semiconductor element 3. Even if the strength of the semiconductor device 1 is doubled, the thickness can be reduced to 1/5. The reinforcing layer 4 can be selected from materials of very wide range. For example, as the reinforcing layer 4, a polycrystalline board having substantially the same material as that for forming a semiconductor chip can be employed.</p> |
